Polymer adhesive for multi-chip module packaging.
نویسندگان
چکیده
منابع مشابه
Multi-chip Module Test Strategies
Products motivated by performance-driven and/or density-driven goals often use Multi-Chip Module (MCM) technology, even though it still faces several challenging problems that need to be resolved before it becomes a widely adopted technology. Among its most challenging problems is achieving acceptable MCM assembly yields while meeting quality requirements. This problem can be significantly redu...
متن کاملStudy on the Thermal Resistance of Multi-chip Module High Power LED Packaging Heat Dissipation System
Thermal resistance is a key technical index which indicates the thermal management of multi-chip module high power LED (MCM-LED) packaging heat dissipation system. In this paper, the prototype structure of MCM-LED packaging heat dissipation system is proposed to study the reliable thermal resistance calculation method. In order to analyze the total thermal resistance of the MCM-LED packaging he...
متن کاملOptoelectronic Multi-Chip Module Demonstrator System
Much research has been conducted in the area of optoelectronic interconnection and packaging technology. Much of this work is an effort to develop high bandwidth and low latency optoelectronic chip-to-chip interconnection, or “optoelectronic multi-chip modules” (OE-MCM’s). Most current designs for optoelectronic OE-MCM technology suffer from problems caused by overly complex optical alignment r...
متن کاملA Field Programmable Multi-chip Module (FPMCM)
Multi-chip module (MCM) packaging can reduce the cost and increase the utility of eld programmable systems. We are currently developing a rst generation Field Pro-grammable Multi-chip Module (FPMCM) as a test vehicle for a particular MCM technology. We present the advantages of MCM for eld programmable systems and develop analytical models for estimating the capacity of FPMCM architectures base...
متن کاملFormulation and heuristic algorithms for multi-chip module substrate testing
Multi-chip module (MCM) substrates are designed for packing two or more semiconductor chips. On these substrates, there are open faults in the wiring, which are electrical disconnections. We must therefore test the substrates to detect open faults, and it is essential to establish an efficient method of testing them. One type of test method uses two probes. Two probes, each touching one edge (e...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Photopolymer Science and Technology
سال: 1993
ISSN: 0914-9244,1349-6336
DOI: 10.2494/photopolymer.6.305